Toshiba's transition to 64-layer
NAND 3D flash memory is likely to continue as the launch of its flagship third
generation BGA SSD, the BG3 Series. In addition to being marketed in a fixed
position and soldered directly to the circuit board, Toshiba also sells a
single packet SSD series to the manufacturer of the form factor M.2 2230.
Now after the full support of
Windows 10 on the latest innovative technology called Host Memory Buffer (HMB),
the current M.2 model has been marketed as an alternative to low cost SATA
DRAMless SSDs. Available in three capacity choices128GB, 256GB and 512GB, the
BG3 Series uses up to 38MB of system memory to make up for not using embedded
DRAM buffers, claiming to offer up to 1,520MBps sequential read performance.
The Host Memory Buffer improves
random performance over products that use architecture without DRAM. Toshiba
claims 80-150% random access increase at high queue depth. While exhibiting BG2
in Flash Memory Summit last year, Toshiba had to load the motherboard BIOS and
special drivers to run on Windows. But that seems no longer necessary today,
given that motherboard manufacturers and Microsoft are said to have now put the
necessary components to bring that technology to market.
As Jeremy Werner, who currently
serves as vice president of SSD marketing and product planning at Toshiba
America Electronic Components, Inc., the third generation Toshiba BG SSD is
designed to spark a revolution in mobile and IoT computing. The BG3 series is
not only smaller and lighter, but smarter thanks to a cost-effective DRAM-less
design with HMB technology combined with 64-layer Toshiba 3D flash memory with
TLC technology. This SSD allows OEMs to reconsider what is possible for their
customers.
The new BG3 will be part of
Toshiba's drive to divert all flash-based products to the latest FLASH BiCS.
SSD is said to have been equipped with controller and memory FLISH BiCS
64-layer 3-bit per cell (TLC) is the latest Toshiba is the same as what is
owned by the XG5 model. Another aspect of this drive will include a new RD
model based on XG5 leading to retailers later this year, as well as an
entry-level DRAMless (TR200) drive that will arrive even faster.
For those who want to know more
about this latest BG3, TR200, and XG5 products made by Toshiba, there is
nothing wrong with waiting for Flash Memory Summit next week!